| 摘要 |
PURPOSE:To prevent the heat increase of an LSI chip with simplified case by air-tightly sealing the element region of the LSI chip and a pad electrode with a seal ring to be connected to the LSI chip and a dielectric substarate. CONSTITUTION:An LSI chip 1 is connected to a pattern 10 on a ceramic substarate 4 via a sealing ring 2, an element region 7 provided on the LSI chip 1 and a pad electrode 3 are air-tightly sealed by the LSI chip and sealing ring. The LSI chip 1 is electrically connected to the ceramic substarate 4 via a bump electrode 5 formed on the pad electrode 3. Thus, it is possible to simplify the case and prevent the heat increase of the LSI chip 1.
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