TESTING METHOD FOR INTEGRATED CIRCUIT CHIP AND INEGRATED CIRCUIT WAFER THEREFOR

摘要

PURPOSE: To facilitate testing an integrated circuit on a wafer by forming a test circuit region on the wafer. CONSTITUTION: A test circuit region 24 has contact pads 28 allowing a test probe of a tester to touch and a demultiplexer 30, capable of feeding a test signal to one of N buses. The demultiplexer 30 has output buses running between rows of chips on a wafer with column select conductors running between columns of the chips. The tester directly currents the demultiplexer 30 and a decoder 32 to select one chip and test only this chip. The test probe is not moved from one chip to another. After testing, the wafer is cut into chips.