| 摘要 |
PURPOSE:To stably detect contact and separation of a bonding wire for an electrode pad formed on a semiconductor chip surface and a metal thin wire connection part of an inner lead of a lead frame, without using a mechanical means. CONSTITUTION:When an electrode pad formed on the surface of a semiconductor chip 6 is connected with the inner lead of a lead frame by using a bonding wire 1, the following are installed; a capilary 3 which moves to a connection part and bonds with pressure a bonding wire to the connection part, an ultrasonic wave oscillator 18 which applies always weak ultrasonic vibration to the capillary 3, an ultrasonic wave detecting circuit 20 which detects the ultrasonic wave which attenuates when the capillary 3 comes into contact with the connection part, and a control circuit 19A which commands pressure contact operation of the capillary 3 at the time of detecting the attenuation. |
