Semiconductor wafer cleaning and rinsing techniques.

摘要

Method comprises: removing the photoresist with a stripper: rinsing by immersing in water; pumping CO2 into the rinsing vessel; and at the same time pumping in water to cause the water to overflow, the overflow rate being at least 50 vol.% per min.. Pref. the wafer is in the rinsing vessel for 5-20, about 10 mins.. The vessel vol. is 4 galls and the water flow rate is 2.5 galls/min.. A batch of wafers is rinsed in the same vessel.