LAMINATED MODULE OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: To provide a stacking module for fitting a large number of semiconductor packages on a limited board surface with a high density. CONSTITUTION: A stacking module is composed of a pair of plates 10 arranged vertically opposite to each other at a specified interval, and each plate 10 is composed of a large number of through-holes 11 for fitting a large number of semiconductor packages 1 to the plate 10, and a large number of conductive lines for uniting the through-holes 11 mutually.