| 摘要 |
<p>A method of heat treating ceramic-based electronic components (20a, 20b) by providing a furnace fixture (14) adapted to support the ceramic-based electronic components (20a, 20b) which is made from a substrate selected from the group consisting of silicon carbide, cordierite, mullite, stabilized zirconia, magnesium oxide and alumina containing a glassy bond phase. A cladding layer of zirconia or magnesia is then deposited on the furnace fixture substrate by plasma deposition. The ceramic-based electronic based components (20a, 20b) to be fired are placed on the zirconia-coated substrate (18); and heated to a desired temperature to heat treat the components (20a, 20b).</p> |
