| 摘要 |
PURPOSE:To obtain a dot printing head thermal radiation structure for raising a throughput by reducing the thermal interaction of a heat generated from a driving element with a heat generated from a driving circuit during the printing. CONSTITUTION:A head substrate 16 is securely bonded to a heat sink 31 so that an exposed part 19a of a heat spreader 19 mounted on the head substrate 16 for releasing a heat of a chip 18 of a wire driving circuit can be exposed from the heat sink 31 for releasing a heat of a demagnetizing coil 23 of a dot printing head 30. |
