发明名称 RELEASING METHOD FOR TREATED MATERIAL
摘要 <p>PURPOSE:To provide a method for releasing a material to be treated, which can release the material from a holding part for the material in an electrostatic chuck, which attracts and holds the material by electrostatic force under a state, wherein the horizontal state is held with the holding part for the material in the electrostatic chuck. CONSTITUTION:A plasma is generated, and a material 5 to be treated is processed in a processing chamber 1. An electrostatic chuck 10 is provided in the processing chamber 1 and sucks and holds the material 5 with the electrostatic force. The material 5 is released from the electrostatic chuck 10 with a releasing means. In this releasing method for the material 5, an applied voltage, which is applied to the electrostatic chuck 10 during the generation of the plasma, is stopped. The material 5 is released from the treated material holding part 11 of the electrostatic chuck 10 with the releasing means during the generation of the plasma.</p>
申请公布号 JPH06326177(A) 申请公布日期 1994.11.25
申请号 JP19930139153 申请日期 1993.05.17
申请人 TOKYO ELECTRON LTD 发明人 SAEKI HIROAKI;KONDO MASAKI
分类号 B23Q3/15;H01L21/302;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B23Q3/15
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