| 摘要 |
PURPOSE:To provide an IC chip which can cope with the arrangement of many kinds of pins of an IC package by one kind of circuit layout. CONSTITUTION:In an IC chip, an input pad for inputting signals, an output pad for outputting the signals, input/output pads for inputting and outputting the signals, power-supply voltage pads for supplying the power and control voltage pads for supplying the control voltages are provided. In this IC chip, the input pad PA and the output pad LN are arranged at the approximately point symmetric positions with respect to the central point. Furthermore, at least two input/output pads RC1 and RC2 are arranged and connected at the approximately point symmetric positions with respect to the central point. Four areas, in a 2X2 array, include at least four power-supply voltage pads VD1, VD3, VD4 and at leats four control voltage pads V11, V12, V13, V14, V21, V22, V23 and V24, which are connected. |
