| 摘要 |
<p>PURPOSE:To provide a method for manufacturing a cruciform or cross-shaped lead for connecting an electrode layer formed on a semiconductor chip to a terminal outside a package readily at a large quantity. CONSTITUTION:The title method includes a process (B) for forming a metallic film 12 on a substrate 10, a process (C) for forming a patterning layer 13 wherein a plurality of cruciform or cross-shaped openings 13a, 13b... are formed on the metallic film 12 by a photolithography method, a process (D) for forming plating layers 14a, 14b... on the metallic film inside the opening of the patterning layer and a process for removing the patterning layer 13.</p> |
