| 摘要 |
PURPOSE:To materialize downsizing and high performance by mounting a group of switching elements, a resistor, etc., large in generation of heat on an insulating substrate being a well heat conductor, and mounting other electronic parts, a capacitor, etc., on a printed board, and arranging both boards close to each other thermally separately so as to reduce the floating gate in a connection loop. CONSTITUTION:A conductive foil 6a is fixed to a well heat conductive insulating substrate 6, and a group of switching elements and groups of other parts such as a resistor, etc., are mounted on it. On the other hand, a capacitor for a gate negative bias power source and a terminal block for gate connection of a self arc-extinguishing element for power to become the target of gate drive are arranged close to each other on a printed board being arranged thermally separately on the tops of this group 2 of switching elements, and they are connected at the shortest distance with this group of switching elements 2. Hereby, the operation speed of the self arc-extinguishing element for power can be increased by making the floating inductance of a wiring loop small, and also the device can be downsized by avoiding the mutual thermal interference between a variety of parts. |
