IMPROVED SEMICONDUCTOR BONDING PAD CONSTITUENT BODY AND ITS MANUFACTURE

摘要

PURPOSE: To provide an improved bonding pad structure and a manufacturing method thereof. CONSTITUTION: A bonding pad structure is formed through such a manner that a barrier layer 22 is attached onto a region located under a semiconductor device, and a first conductive layer is attached onto the barrier layer 22. The barrier layer 22 and the first conductive layer are patterned and etched so as to demarcate a conductive region 30. A preferable example is that the conductive region 30 is formed like a lattice. A second conductive layer is attached onto the conductive region 30 and an exposed part of a lower region. The second conductive layer is formed into a contact excellent in adhesion to the lower region, and a bonding pad is protected against lift-off or separation.