发明名称 ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURE
摘要 <p>PURPOSE:To provide an electronic circuit device containing film-state coil parts by inserting the lower main body part of a core into a through hole of a printed wiring board, formed in lamination. CONSTITUTION:Consists of a core 8 having an upper projecting part 8a and a lower main body part 8b, the first printed wiring board 1a having the first through hole 7a, and the second printed wiring board 1b having the second through hole 7b. In addition, a core land 10 is formed around the peripheral of the first printed wiring board 1a, and a coil pattern 4 is formed around the peripheral of the second printed wiring board 1b. These the first and second printed wiring board 1a and 1b configured in lamination. Then the lower main body part 8b of the core 8 is inserted into the through holes 7a and 7b, and a soldering metal coating 8c coated on the upper projecting part 8a is soldered to the core land 10. Further, an electronic part 2 is soldered to an electronic parts land 9.</p>
申请公布号 JPH06152145(A) 申请公布日期 1994.05.31
申请号 JP19920313965 申请日期 1992.10.29
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 YOKOTE NOBUYUKI;HIRUMA YOSHIAKI
分类号 H01F17/00;H01F17/04;H05K1/16;H05K1/18;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01F17/00
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