| 摘要 |
PURPOSE:To reduce failure rate in assemblage by arranging bonding pads, corresponding to I/O cells, on the outside of I/O cell region thereby increasing the degree of freedom in the placement of bonding pads. CONSTITUTION:When bonding pads 6, 14 are arranged on the outside of an I/O cell region 4 where I/O cells 5, 12, 13 are arranged, placement of bonding pad is allowed over the extension of border line of adjacent I/O cell and thereby insufficient contact with an adjacent bonding wire can be prevented. |
