发明名称 |
Method for manufacturing a narrowed sidewall spacer in a peripheral circuit of a ULSI semiconductor memory device |
摘要 |
A method for manufacturing ULSI semiconductor memory devices is disclosed which uses an insulating film to form a side wall spacer of the gate electrodes of transistors formed in the peripheral circuit section of a memory device. This scheme prevents surface deterioration of the underlying structure during an etching process for manufacturing of a cell capacitor of a memory cell device cell array portion. The insulating film includes a laminated film composed of a thin oxide film and an etch blocking film formed on the oxide film. Due to the etch blocking film, the oxide film can be made thin, resulting in the formation of side wall spacers that are appropriately narrow. Thus, the function and operating speed of the peripheral circuit transistors is improved.
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申请公布号 |
US5296399(A) |
申请公布日期 |
1994.03.22 |
申请号 |
US19920966899 |
申请日期 |
1992.10.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, YOUNG-WOO |
分类号 |
H01L27/10;H01L21/8242;H01L27/108;(IPC1-7):H01L21/70;H01L27/00 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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