| 摘要 |
PURPOSE:To improve humidity resistance of a light emission diode which is formed by sealing a light emitting diode pellet with transparent resin. CONSTITUTION:An outside of a transparent mold resin 2 which seals a light emitting diode pellet 1 is coated with second mold resin 3 to form a dual mold structure and deterioration of humidity resistance is improved, which is caused by high moisture absorption property of transparent resin. Transparent resin is used also for the second mold resin 3. Otherwise, a part excepting a lens part formed in transparent mold resin is coated with second non-transparent mold resin of high humidity resistance. |
