| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor sealing epoxy resin composition which has a low dielectric constant after curing, and simultaneously, can be tableted, and accordingly has high productivity in the semiconductor sealing step. SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a hollow inorganic filler as the essential components, and the porosity of its cured product is 15-60 vol.%, and preferably, the withstanding pressure of the hollow inorganic filler is≥100 MPa. COPYRIGHT: (C)2004,JPO
|
