发明名称 WAFER PROCESSOR AND WAFER THROUGH PROCESSOR
摘要 <p>PURPOSE:To shorten a wafer processing time by expediting drying of a wafer processed with processing solution (e.g. cleanser). CONSTITUTION:A wafer processor has a spin chuck 12 in a processing chamber 11, and comprises a heater 21 for heating a surface of the wafer 91 placed on the chuck 12 to expedite drying of the wafer 91 in the chamber 11. Or, the processor comprises a gas supply unit (not shown) for supplying dry gas to the surface of the wafer 91.</p>
申请公布号 JPH05326483(A) 申请公布日期 1993.12.10
申请号 JP19920148592 申请日期 1992.05.15
申请人 SONY CORP 发明人 MINAMI MASAKI
分类号 H01L21/304;H01L21/68;H01L21/683;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址