| 摘要 |
PURPOSE:To enhance reliability against corrosion by enhancing thermal conductivity. CONSTITUTION:The cooling structure for integrated circuit comprises a cooling vessel 9 fixed through a heat transmitting body 3 onto a plurality of integrated circuits mounted on a wiring board while being provided with a counterbore structure on the opposite side to the integrated circuit 1, and a nozzle 8 having an inlet and an outlet sealed through O-rings 4 on the inside of the cooling vessel 9 and movable on a piston. The nozzle 8 is secured to an outer frame 12 having a channel for liquid medium jetted from the tip of the nozzle 8. A spring 10 is disposed between the cooling vessel 9 and the outer frame 12 in order to urge the cooling vessel 9 toward the integrated circuit 1. |
