Ein Verfahren zum Herstellen einer gedruckten Schaltungsplatte für Halbleiterschaltungen.

摘要

The wiring board (10) has a conductor circuit (13) on the surface and contains an IC module (12) mounted with an IC chip (11). Both surfaces of the board are covered with over sheets (32). Bumpers (20) are formed on portions of the conductor circuit (13), which serve as external contact terminals. The bumpers are made of any conductive material, such as copper or nickel, and the surfaces are to be coated with hard conductive alloys. The thickness should be 0.1-0.3mm so that the contact surface can be of the same level as the over sheets. External contact terminals are thus resistant to outer mechanical forces.