| 摘要 |
<p>PURPOSE:To hold a semiconductor chip with a fixed holding force irrespective of the size of the chip without using any bonding agent which may deteriorate the quality of the chip so that the chip can be removed without damage. CONSTITUTION:A substrate 1 made of soft rubber is stuck to a resin sheet 3a and a hole 4 and cavity section 5 communicated with the hole 4 are formed through the substrate 1. Then a chip 2 is put on the substrate 1 so that the chip 2 can block the hole 4 and, by pushing the chip 2 against the sheet 3a side, the section 5 is evacuated to a vacuum state so that the chip 2 can be held by suction. At the time of removing the chip 2 from the substrate 1, the sheet 3a is pierced with a needle 7 so as to introduce air into the section 5 and the chip 2 is picked up with a suction pad.</p> |
