| 摘要 |
An apparatus for manufacturing electrical interconnection assembly in which a wire is laid on wire laying pins on a pin board or an insulating support body at high velocity and with high density. The electrical interconnection assembly manufacturing apparatus according to the present invention comprises: a pinboard; a plurality of wire laying pins standing on the pinboard; a slide plate opposing tips of the wire laying pins; and a nozzle attached to the slide plate, wherein the pinboard and the slide plate relatively move under the condition that the pinboard opposes the slide plate while a wire fed from the nozzle is laid on the plurality of wire laying pins. |
