| 摘要 |
<p>PURPOSE:To increase the number of leads without generating leakage or short- circuit between leads by using the same size package, when the function of a semiconductor device is increased and many leads are needed. CONSTITUTION:Two columns of leads are alternately arranged in an upper line and a lower line on the side surface 2a of a package 2. Since leads in the package 2 are connected with a semiconductor chip, a lower side lead 5 is arranged inside an upper side lead 1, in order to prevent the contact of a lead wire or the load thereon.</p> |
