发明名称 LIQUID PHOTO-SOLDER RESIST INK COMPOSITION
摘要 <p>PURPOSE:To provide a liquid photo-solder resist ink composition having high resolution and excellent electrical properties. CONSTITUTION:The objective liquid photo-solder resist ink composition is composed of (A) a compound containing >=2 (meth)acrylate groups and >=1 carboxyl group in one molecule, having a molecular weight of <=1,000 and exhibiting liquid state at room temperature, (B) an epoxy compound containing >=2 epoxy groups in one molecule, (C) a cure accelerator for the epoxy resin and (D) a photopolymerization initiator.</p>
申请公布号 JPH05202332(A) 申请公布日期 1993.08.10
申请号 JP19920033963 申请日期 1992.01.27
申请人 TAIYO INK SEIZO KK 发明人 YOSHIDA KAZUHIRO
分类号 G03F7/027;C09D11/00;C09D11/033;C09D11/10;C09D11/101;C09D11/102;C09D11/106;H05K3/06;H05K3/28 主分类号 G03F7/027
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