| 摘要 |
PURPOSE:To enable a light emitting element to be attached to a supporting substrate by face down bonding method by forming a island-shaped part consisting of plural layers of semiconductor layers different in conductivity type on a semiconductor substrate, and forming a first electrode on the top and the side of the island-shaped part and a second electrode on the semiconductor substrate. CONSTITUTION:The buffer layer 2, the first to third semiconductor layers 3, 4, and 5, and the ohmic contact layer 6 on a semiconductor substrate 1 are etched in the shape of the contour of a light emitting element, and there an island is made. Next, a translucent insulating film 7 is made on the semiconductor substrate 1 and the side of semiconductor layers 2-6 made in island shape. Next, a first electrode 8 is made, excluding one side, from on the semiconductors 2-6 to the side, and a second electrode 9 is made on the semiconductor substrate 1, thus a semiconductor light emitting element is completed. Next, the first electrode 8 and the second electrode 9 being the semiconductor light emitting elements are counterposed and positioned, and are fixed to a supporting substrate by micropump bonding method. |
