| 摘要 |
PURPOSE:To enable the voltage application from the rear side of a semiconductor chip, in a semiconductor integrated circuit device where the semiconductor chip mounted on a package substrate through a CCB bump is sealed with a cap. CONSTITUTION:A cap 11 is joined by sealing solder 12a to the main face of a package board 2 where a semiconductor chip 7 is mounted through a CCB bump 6 so as to seal the semiconductor chip 7. And in a chip carrier 11 where the bottom of the cap 11 and rear of the semiconductor chip 7 are joined with a heat conductive solder 12b, the sealing solder 12a and the heat conductive solder 12b are connected electrically through metallized layers 13a, 13d, and 13c, and the sealing solder 12a and the electrode 3b made on the rear of the package board 2 are connected electrically through the inner layer wiring 4a made in the package board 2. |
