| 摘要 |
PURPOSE:To realize remarkable multipin structure through improvement of joining intensity by conducting again, after the first thermal pressure bonding, on the occasion of conducting thermal pressure bonding for the overlapped leads wires, the thermal pressure bonding using a tool which is shifted by 1/2 or more the tool contact thickness from the preceding joining area. CONSTITUTION:A lead frame 2 is placed on a stage 10 and an outer lead 8 of a TAB tape 5 is overlapped on an inner lead 7 of the lead frame through the alignment. A first thermal pressure bonding, that is, a pressure indentation 12 indicated at the first joining tool center line 11a is conducted with a tool 9. Thereafter, the thermal pressure bonding, namely pressure indentation 13 is conducted with the tool 9 shifted to the second joining tool center line position 11b. The thermal pressure bonding through shifting of the joining position is not limited only twice, but a plurality of times of thermal pressure bonding may be conducted. In this case, it is enough to keep the displacement between the preceding and the next thermal pressure bondings to 1/2 or more the contact width of the tool 9. Thereby, a failure rate may be reduced distinctively and a composite lead frame ensuring high joining intensity can be obtained. |
