发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A photosensitive resin composition which is developed by an aqueous alkali solution and has excellent sensitivity, resolution and resistance against electroless plating solution, comprising a graft polymer having, as branch polymers, a polymer of a monomer that has hydrophilic groups, and a binder polymer which is soluble or swellable in an aqueous alkali solution and is capable of forming a film. The composition comprises a graft polymer which has, as branch polymers, a polymer of a monomer that has hydrophilic groups, a binder polymer which is soluble or swellable in an aqueous alkali solution, an ethylenically unsaturated compound, and a photopolymerization initiator.</p>
申请公布号 WO1993006529(P1) 申请公布日期 1993.04.01
申请号 JP1992001166 申请日期 1992.09.11
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