发明名称 |
Epoxy resin composition for encapsulating electric circuit components |
摘要 |
An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO2 in pre-hardening storage of the resin.
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申请公布号 |
US5189080(A) |
申请公布日期 |
1993.02.23 |
申请号 |
US19920830503 |
申请日期 |
1992.01.31 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
HEYKE, KLAUS;SPITZ, RICHARD;SEIDEL, HANS-JOACHIM;JENNRICH, IRENE;PFANDER, WERNER;VOHR, ARMIN |
分类号 |
C08G59/24;C08G59/42;C08G59/68;C08K3/36 |
主分类号 |
C08G59/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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