| 摘要 |
In a method of applying a cavity forming material onto vibrating electrode parts provided on front and back surfaces by supplying the cavity forming material from above an uprightly arranged piezoelectric substrate, a cavity is defined not only around the vibrating electrode parts but also along the upper edge portion of the piezoelectric substrate upon sealing with armoring resin, since the cavity forming material partially remains on the upper edge portion of the piezoelectric substrate. Thus, necessary damping is not performed and spurious vibration is increased. According to the present invention, a solder damping electrode is provided at least on one of front and back surface portions of the piezoelectric substrate close to the upper edge portion supplied with the cavity forming member and solder is provided on this electrode, whereby spurious vibration of the upper edge portion of the piezoelectric substrate is damped by additional mass of the solder.
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