| 摘要 |
PURPOSE:To facilitate change from the anode grounding mode to the cathode grounding mode and vice verse by a method wherein an anode electrode pattern and a cathode electrode pattern are formed extending over the total three surface i.e., a photodiode packaged surface and a pair of two parallel surfaces orthogonal to the photodiode packaged surface. CONSTITUTION:In order to change from the anode grounding mode to the cathode grounding mode, anode electrode 2 and cathode electrode 3 of a chip carrier 5 for photodiode are changed with each other leaving a photodiode 1 intact facing in the x direction. That is, if the anode electrode 2 is mounted with the surface A facing downward in the anode grounding mode while the surface C facing downward in the cathode grounding mode, the grounding mode can be changed on the same packaged surface. Accordingly, only replacing A surface with the C surface is enough in the cathode grounding made, similar to the anode grounding mode. Through these procedures, the anode grounding mode and the cathode grounding mode can be changed with each other.
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