Semiconductor wafer-securing adhesive tape.

摘要

There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a specified styrene/ethylene/butene/styrene (SEBS) block-type copolymer or a specified styrene/ethylene/pentene/styrene (SEPS) block-type copolymer, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided and has a transfer-preventing layer laid on the other surface of the center layer. There is also disclosed a semiconductor wafer-securing adhesive tape wherein the center layer of said semiconductor wafer-securing adhesive tape has a film comprising said SEBS block copolymer of SEPS block copolymer, ethylene/acrylate-type copolymer and/or amorphous poly alpha -olefin, and polyamide/polyether-type copolymer, in a specified composition ratio.