HIGH TEMPERATURE RELEASE SHEET FOR PRINTED CIRCUIT BOARDS

摘要

DC-0221 A process and nylon release sheet for manufacturing printed circuit boards from epoxy prepregs is disclosed. In such process layers of the prepregs are separated from one another by a release sheet. The release sheet comprises an aliphatic or aromatic nylon or nylon copolymer which is a condensation product of a dicarboxylic acid and a diamine. The nylon film contains a heat stabilizer and an inorganic particulate antiblock additive, e.g. diatomaceous earth, glass beads, amorphous silica, talc, mica and molybdenum disulphide. The nylon may be toughened by the addition of a phosphoruscontaining catalyst or an epoxide.