| 摘要 |
PURPOSE:To manufacture the title resin sealed semiconductor device capable of increasing the mounting density of printed board by a method wherein the first insulating sheet mounting the first semiconductor chip to be bonded onto the surface of an inner lead as well as the second semiconductor chip to be bonded onto the rear surface of the inner lead are arranged. CONSTITUTION:An insulating sheet 2 whose both sides are coated with a bonding agent is bonded onto the surface of an inner lead 1 so as to mount a semiconductor chip 4 by bonding step. Likewise, another insulating sheet 3 is bonded onto the rear surface of the inner lead 1 so as to mount another semiconductor chip 5. At this time, the inner lead 1 and the semiconductor chips 4, 5 are electrically connected by bonding wires 8. In such a constitution, a multitude of semiconductor chips to be sealed are mounted on both surfaces of the inner lead 1 of a lead frame so that the plane area required for mounting step may be reduced thereby reducing the plane area of a package. |
