| 摘要 |
<p>PURPOSE: To reduce the lateral area required for high density interconnection structure by providing a flexible interconnection part formed of a plurality of flexible conductors, and a major surface arranged with contact pads and bonding the major surface to a dielectric of flexible interconnection structure. CONSTITUTION: A plurality of chips 20 are fixed in a cavity of a board 14 and a high density interconnection structure 30 is bonded to the upper surface of the board 14 thus providing electrical interconnection of the chips 20 and the outside. The high density interconnection structure 30 has a dielectric layer 32, e.g. a thermosetting layer of polyimide. The part 39 of interconnection structure has flexibility. A supporting member 16 and the relevant part 39 of interconnection structure are curved smoothly upward with respect to the plane of the board 14 and a conductive wire 34 is laid vertically to the upper surface of the board 14. More specifically, they are bent to protect a conductor structure against adverse effect or variation being derived from a stress.</p> |
