发明名称 CONDUCTOR FOIL ASSEMBLY AND MANUFACTURE OF CONDUCTOR FOIL ASSEMBLY AS WELL AS CONDUCTOR FOIL LAMINATE
摘要 <p>PURPOSE: To protect the conductive copper foil used in a printed substrate from the damage received during storage, transport and secondary processing by coating at least the single surface of the foil with a plastic film. CONSTITUTION: A film 24 is bonded to a foil 20 in a peelable manner by perfectly expelling the gaseous substance present between the film 24 and the foil 20. The film 24 exactly coincides with the contour or shape possessed by the surface of the foil 20 and, since the film 24 certainly comes into contact with the surface of the foil 24, the film 24 is moved in the exact contact state with the foil 20 and the film 24 can be used for applying next treatment to the foil 20. By charging static electricity to the film 24 and the foil 20 in reverse polarity so as to be capable of sufficiently extruding air from the gap between the film 24 and the foil 20, the air between both of them is perfectly eliminated. For the purpose of keeping the relation of the coating and protection to the foil 20 and holding the peeling properties from the foil after lamination processing, the film 24 withstands the temp. and pressure condition in a lamination process.</p>
申请公布号 JPH04221629(A) 申请公布日期 1992.08.12
申请号 JP19910067160 申请日期 1991.03.29
申请人 GOULD INC 发明人 JIEIMII EICHI CHIYANBAAREIN;ROORANDO DEI SABEEJI;JIYON PII KIYARAHAN;DEIBITSUDO PII BAAGESU
分类号 B32B15/08;B32B7/06;B32B37/10;H05K1/03;H05K3/02;H05K3/38 主分类号 B32B15/08
代理机构 代理人
主权项
地址