| 摘要 |
PURPOSE:To prevent flow-out of a gas for preventing oxidation of solder for maintaining a stable atmosphere for preventing oxidation and obtain a soldering device with a high soldering quality by providing a lid part for closing an opening which is formed at an atmosphere cover and then sealing the atmosphere for soldering by the lid part when performing soldering. CONSTITUTION:In a process where a spindle 6 descends through a collet 5 while a semiconductor chip 1 is sucked in vacuum, a lid part 10 which is supported to the spindle 6 through a bearing 14 and a spring 11 also descends simultaneously. At this time, the lid part 10 hits against an atmosphere cover 7 and then stops and then slides against the spindle 6 through the bearing 14 and is pressed against the atmosphere cover 7 by a force of a spring 11 where the spring 11 is compressed, thus enabling an opening 7a of the atmosphere cover 7 to be sealed by the lid part 10. In this state, since a specified gas is supplied to an adhesion treatment part which is sealed through a valve for supplying gas 9 from a gas supply source 8, that part becomes a stable oxidation prevention gas atmosphere, and thus a high-performance soldering can be attained. |
