发明名称 METALLIC FILLER COMPOSITION AND USE THEREOF
摘要 <p>Metal filler compositions and methods of employing the same are disclosed, in which the compositions are copper base with the addition thereto of tin and silicon. For thermal spraying applications, aluminum is included in the formulation. By practice of the invention, substantial improvements in bond strength and quality of the surface finish are achieved.</p>
申请公布号 JPH04141568(A) 申请公布日期 1992.05.15
申请号 JP19900416360 申请日期 1990.12.27
申请人 DEBITSUDO DEI KIIRUNEN;DEBITSUDO EE SAATAA 发明人 DEBITSUDO DEI KIIRUNEN;DEBITSUDO EE SAATAA
分类号 B24B1/00;B23P6/00;C23C4/04;C23C4/06;C23C4/18 主分类号 B24B1/00
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