发明名称 |
METALLIC FILLER COMPOSITION AND USE THEREOF |
摘要 |
<p>Metal filler compositions and methods of employing the same are disclosed, in which the compositions are copper base with the addition thereto of tin and silicon. For thermal spraying applications, aluminum is included in the formulation. By practice of the invention, substantial improvements in bond strength and quality of the surface finish are achieved.</p> |
申请公布号 |
JPH04141568(A) |
申请公布日期 |
1992.05.15 |
申请号 |
JP19900416360 |
申请日期 |
1990.12.27 |
申请人 |
DEBITSUDO DEI KIIRUNEN;DEBITSUDO EE SAATAA |
发明人 |
DEBITSUDO DEI KIIRUNEN;DEBITSUDO EE SAATAA |
分类号 |
B24B1/00;B23P6/00;C23C4/04;C23C4/06;C23C4/18 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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