| 摘要 |
A process for bonding a polyolefin, polyfluoroolefin, polyethylene terephthalate, polyacetal, nylon or plasticizer-rich soft polyvinyl chloride substrate to a like substrate or for bonding a polyolefin, polyfluoroolefin, polyethylene terephthalate, polyacetal, nylon or plasticizer-rich soft polyvinyl chloride substrates to another substrate which comprises applying to the surface of at least one of the substrates to be bonded together an adhesion promoter composition comprising 0.001-10 wt. % of at least one organometallic compound containing a metal selected from the group consisting of typical metals, applying a cyanoacrylate-based adhesive comprising an alpha-cyanoacrylate and bringing together the thus-treated surface of the substrates to be bonded.
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