| 摘要 |
<p>PURPOSE:To directly connect a heat spreader secured with a semiconductor chip to a heat sink plate, to reduce a thermal resistance of a heat generating element and to improve heat dissipating characteristic by providing a through hole at a ceramic board. CONSTITUTION:Through holes 16 of the number corresponding to the number of active elements to be placed on a ceramic board 12 are formed, and semiconductor chips 18 generating heat such as an N-P-N transistor, P-N-N transistor, etc., are disposed in the holes 16. Since the chips 18 are secured on a heat sink plate 11 exposed in the holes 16 of the board 12 through a heat spreader 19, a thermal resistance from the chip 18 to the plate 11 is small, and the heat dissipating characteristics of the chip 18 can be improved. Since it is disposed through the spreader 19 having a certain thickness in the hole 16, the heights of the surfaces of the chips 18 and the boards 12 can be set uniformly, and they are installed in the holes 16, the entire device can be reduced in thickness.</p> |
