| 摘要 |
PURPOSE:To enhance a semiconductor device in heat dissipating effect keeping it high in characteristics. CONSTITUTION:An iron-nickel alloy lead frame is equipped with a stage 11a where a semiconductor chip is mounted and inner leads 11b located corresponding to electrode pads in the vicinity of the stage 11a, where a heat sink 23 of copper or aluminum or its alloy is provided to the rear of the stage 11a where a semiconductor chip is mounted. |
