WAFER SECURING JIG AND EXPOSURE DEVICE USING THE SAME

摘要

PURPOSE:To improve exposure accuracy of a wafer by setting an angle crossing an exposure light coming direction of flat surfaces of steps cut at a tapered inner edge near the outer periphery of the wafer. CONSTITUTION:A wafer securing jig 10 is formed in an annular shape in which its center is so bored as to be larger by a predetermined size than the contour of a wafer W. A plurality of clamping pawls 12 protrudes at positions to be equally divided in a circumferential direction at its inner periphery 11. The pawls 12 are engaged with the outer periphery of the wafer W, and the wafer W is secured to a wafer chuck 2O2A. A plurality of steps 13 are cut at tapered surfaces 11a and 12a of the edge 11 and the pawls 12 of the jig 10. Thus, exposure light P incident to the surfaces 11a and 12a is reflected to the side of coming direction of the light P at opposite side to the wafer W disposed down. An irregularity in illuminance due to the introduction of the light to the indeterminate region of the wafer W is prevented.