发明名称 INDOOR WIRING METHOD EMPLOYING HOT-MELT ADHESIVE
摘要 <p>PURPOSE:To facilitate an efficient wiring work without creating noise and vibration by a method wherein, immediately after hot-melt adhesive which is softened at a high temperature and hardened at a low temperature is applied to the floor surface or the wall surface of a building at a high temperature, indoor wirings are pressed against the adhesive and the adhesive is cooled naturally. CONSTITUTION:Hot-melt adhesive 3 which is softened at a high temperature and hardened at a low temperature is inserted into a gun 4 and the gun 4 is warmed by electric power or gas to soften the adhesive 3. Then the softened hot-melt adhesive 3 is applied to an adhesion point 5 on the wiring route of an object surface 1 on which the wirings are installed and indoor wirings 2 are pressed against the adhesive 3 immediately. After the hot-melt adhesive 3 is hardened by natural cooling, the fixing of the indoor wirings 2 is confirmed. This process is repeated at a plurality of the adhesion points 5. With this constitution, a wiring work can be performed efficiently without creating noise and vibration.</p>
申请公布号 JPH048110(A) 申请公布日期 1992.01.13
申请号 JP19900108779 申请日期 1990.04.26
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 AWAJI SHUICHI;WADA TOYOMITSU
分类号 H02G1/06 主分类号 H02G1/06
代理机构 代理人
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