发明名称 MANUFACTURE OF COMPOSITE MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To enable a PWB material confronting a flexible part to be easily cut off to remove without preventing the flexible part from being bent by a method wherein a V-shaped groove is provided at least to either of the inner side and the outer side of a composite multilayer printed wiring board along a boundary between a flexible part and a rigid part. CONSTITUTION:A PWB material 3A is placed on a cutting edge form 13A, and a metal plate 11 is mounted thereon, which is pressed by a pressing machine to provide V-shaped grooves 7a to the PWB material 3A. An inner conductor is formed on a printed board through a pattern etching method, then overlay films are laminated to form an FPC material 1, an adhesive sheet 2 is provided with a hole bored in a part which confronts a flexible part. Then, the printed board provided with the inner conductor, the FPC material 1, the adhesive sheet 2, and the PWB material 3A are stacked up, which is bonded by thermocompression. In succession, a through- hole 6 and an outer pattern 5 are provided to the printed wiring board formed so far, which is subjected to an outer shape processing. Furthermore, The PWB material 3 is cut off along the V-shaped groove 7a, and a PWB material 3B located on a flexible part 14B is removed, whereby a required composite multilayer printed wiring board can be realized.
申请公布号 JPH03262195(A) 申请公布日期 1991.11.21
申请号 JP19900062230 申请日期 1990.03.12
申请人 SHARP CORP 发明人 SAITO HIDEO;YAMAGUCHI CHIHIRO
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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