| 摘要 |
PURPOSE:To obtain a laminate excellent in electrical characteristics, dimensional stability, heat resistance and drill processability by laminating a homopolymer or copolymer of a specific fluorice-containing divinyl ether compound on a metal. CONSTITUTION:A laminate is formed by laminating a homopolymer or copoly mer of a fluorine-containing divinyl ether compound represented by general formula (I) (wherein j and k are respectively 0 or 1, l and m are respectively an integer of 0 or more, n is an integer of 2 or more and j, l and m are together 0 when k is 1) to a metal. Since the homopolymer or copolymer is obtained by bulk polymerization aiming at molding, a mixture prepared by adding a polymerization initiator and, if necessary, an inorg. powder and a filler to the monomer or the flowable prepolymer thereof is held between two flat plates and polymerization is advanced to obtain a flat polymer. In the case of replacement by cloth, a cloth reinforced flat polymer is obtained. The thickness of the polymer layer is pref. 0.05-2mm in a case used as a low dielec tric circuit board and, when the laminate is used as a printed circuit board, copper or aluminum of 0.1-50mum is pref. |
