| 摘要 |
<p>PURPOSE:To facilitate high density mounting by forming a chip, which is inlaid in a substrate having a conductor and which requires no wiring or terminals, by connecting with conductor and leading a metal thin film on the upper surface of the chip via a conductive pad. CONSTITUTION:An N type CaAs chip 4 having a P type region 5 is formed in a dent with baked conductors 2, 2'. Metal thin films 7, 8 as a conductor from each region are formed in the upper surface of a chip and are connected to the conductor 2, 2' of the substrate via electrode pads 8, 9 and then led to outside. The entire surface of the chip is covered with an epoxy resin protective film. This makes the terminals or wire unnecessary facilitating a high density mounting to the printing substrate.</p> |
