| 摘要 |
PURPOSE:To reduce the number of times of the exchange of chip trays, and moreover to enhance workability of an operator without stopping the operation of a chip fitting device at chip exchange time by a method wherein supply of the chip trays is performed by a tray magazine unit accommodating the chip trays of the plural number accommodating semiconductor chips. CONSTITUTION:Chip trays 11 loaded to capacity with chips previously are accommodated in a tray magazine 12, then the accommodating position of the chip tray 11 positioning at the highest stage, for example, is made to coincide with height of a tray supporting base 20 according to ascent and descent of an elevator 15, and then the chip tray 11 is pushed out onto the tray supporting base 20 according to an extrusion cylinder 14. After the tray is pushed out, the position of a pickup collet 17 is controlled in regard to transfers in the respective directions shown with arrow marks h-j according to a driving device, the chips are taken out from the chip tray 11 one piece by one piece, and the chips are supplied on a middle table. After the chips in the chip tray 11 are removed wholly, the empty chip tray is pushed back into the tray magazine 12 according to an accommodation cylinder 13, then the elevator 15 is ascended to perform the same work to the new chip tray of a second stage. |
