| 摘要 |
<p>PURPOSE:To enhance a mounting density by piling up packages on the same wiring board in a multistage and multiple manner by a method wherein a plurality of leads are formed in such a way that they are bent along the surface and the rear surface of a package main body. CONSTITUTION:In a surface-mount package semiconductor device, leads 6 in parts are bent along the surface of a package. In the surface-mount package semiconductor device, the leads 6 in the parts are bent along the surface of the package main body and leads 7 in other parts are bent along the rear surface. When a semiconductor device is mounted on a wiring board, a semiconductor device is mounted so as to be piled up on it in a small-sized semiconductor device 8; the leads of the upper semiconductor device are brought into contact with leads bent on the surface of the lower semiconductor device and are connected by a solder; the devices are mounted.</p> |
