| 摘要 |
1,156,399. Semi-conductor devices. INTERNATIONAL RECTIFER CORP. 14 June, 1967 [26 July, 1966], No. 27395/67. Heading H1K. As shown, Fig. 5, a semi-conductor device having two extending leads 19, 20, is mounted in a metal housing comprising a base-plate 14 having an opening 22, and a hollow body 15 having a conductive tube 17 extending through, but insulated from, its closed end, by passing one lead 20 through tube 17, threading a solder ring (40, Figs. 3 and 4, not shown) and baseplate 14 on to lead 19, welding base-plate 14 to body 15, melting the solder ring (40) to solder lead 19 to plate 14, and sealing tube 17 to lead 20. The semi-conductor device may be a diode or a transistor and in the embodiment comprises a junction diode wafer 33 mounted between the ends 31, 32 of leads 19, 20 and encapsulated in potting compound 21. Body 15 is insulated from tube 17 by a glass bead 16 and may have a welding projection 30 at its open end. The baseplate 14 is secured to body 15 by resistance welding, and lead 19 is then soldered to baseplate 14 by heating in vacuo. The assembly is then placed in an atmosphere of nitrogen, or other inert gas, to fill the housing via tube 17 which is then hermetically crimped round lead 20. The housing may be of the "top hat" type, i.e. the body has an outwardly extending flange at its open end and the base-plate is enlarged. |
