| 摘要 |
<p>PURPOSE:To improve the heat dissipating property by arranging a heat conductive plate member on the outermost layer surface and subjecting the portion of said plate member where a conductor part is to be formed to a clearance treatment. CONSTITUTION:A ceramic plate member 6 is buried in the outermost layer surface. This plate member 6 is made of the ceramic having a good heat dissipating property and a good heat conductivity. In this plate member 6, the portion where a conductor part is to be formed, for example, where a through-hole 5 penetrates, is subjected to a clearance treatment. By thus arranging the plate member 6, if the mounted electronic part emits heat, the heat can be dispersed to the whole wiring board, so that concentration of the heat can be prevented. Accordingly, the whole wiring board works as a heat dissipating area and a heat dissipating efficiency is improved. As a thermal expansion coefficient of the plate member 6 is small, a warpage caused by thermal expansion does not occur.</p> |
